Wired circuit board

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C360S245900

Reexamination Certificate

active

07629539

ABSTRACT:
A wired circuit board has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a plurality of wires arranged in mutually spaced-apart relation, and a plurality of semiconductive layers formed on the insulating layer and electrically connected to the metal supporting board and the respective wires. The semiconductive layers are provided independently of each other in correspondence to the respective wires.

REFERENCES:
patent: 6316734 (2001-11-01), Yang
patent: 6801402 (2004-10-01), Subrahmanyam et al.
patent: 2003/0089520 (2003-05-01), Ooyabu et al.
patent: 2004/0221447 (2004-11-01), Ishii et al.
patent: 2006/0190673 (2006-08-01), Arai et al.
patent: 2003-152383 (2003-05-01), None
patent: 2004-035825 (2004-02-01), None
patent: 2004-335700 (2004-11-01), None
patent: 2006-134421 (2006-05-01), None

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