Semiconductor device

Details Semiconductor device Semiconductor device

2007-02-26

2009-10-06

Doan, Theresa T (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S686000

Reexamination Certificate

active

07598618

ABSTRACT:
A semiconductor device that enables the transmission time of a signal and implementation area to be reduced, and a method for manufacturing the same. A semiconductor device includes a first semiconductor substrate, a capacitor chip, an external input terminal, and an external output terminal. The first semiconductor chip includes a first surface, a second surface, an eleventh through-hole electrode, a twelfth through-hole electrode, and a thirteenth through-hole electrode. The capacitor is laminated on the first semiconductor chip and includes a third surface. A capacitor element is formed on the third surface. The capacitor element functions as a condenser component in the periphery of the first semiconductor chip. The external input terminal is electrically coupled to the capacitor element and the twelfth through-hole electrode through the eleventh through-hole electrode. The external output terminal is coupled to the circuit element through the thirteenth through-hole electrode.

REFERENCES:
patent: 6914322 (2005-07-01), Iijima et al.
patent: 2007/0126085 (2007-06-01), Kawano et al.
patent: 11-3969 (1999-01-01), None

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