Formation of dielectric film by alternating between...

Details Formation of dielectric film by alternating between... Formation of dielectric film by alternating between...

2008-04-08

2009-10-20

Chen, Bret (Department: 1792)

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

C427S097100, C427S249100, C427S255700, C427S577000

Reexamination Certificate

active

07604834

ABSTRACT:
The present invention discloses a method including: providing a substrate; and sequentially stacking layers of two or more diamond-like carbon (DLC) films over the substrate to form a composite dielectric film, the composite dielectric film having a k value of about 1.5 or lower, the composite dielectric film having a Young's modulus of elasticity of about 25 GigaPascals or higher.

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