Cleaning and liquid contact with solids – Processes – Using sequentially applied treating agents
Reexamination Certificate
2005-04-08
2009-08-25
Carrillo, Sharidan (Department: 1792)
Cleaning and liquid contact with solids
Processes
Using sequentially applied treating agents
C134S028000, C134S034000, C134S036000, C134S041000, C134S042000, C427S096400, C427S304000, C427S305000, C427S306000, C427S550000, C427S551000, C427S552000, C427S553000, C427S554000
Reexamination Certificate
active
07578888
ABSTRACT:
The present invention relates to a method for treating plastic substrates structured by means of a laser or generation of seed structures on the surface that are suitable for subsequent metallization. The substrates, after the laser structuring, are brought into contact with a process solution that is suitable for removal of the unintentional deposits that arise during the laser structuring. The treatment of the laser-structured substrates with a mixture of wetting agents and compositions that support the cleaning before metallization leads to sufficient removal of the unintentionally deposited metal seeds, without having a lasting damaging effect on the planned structured surface paths.
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Carrillo Sharidan
Enthone Inc.
Senniger Powers LLP
LandOfFree
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