Memory module having on-package or on-module termination

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S764000, C361S803000, C365S063000

Reexamination Certificate

active

07542305

ABSTRACT:
A memory module adapted for installation in an open memory socket on a mainboard of a computer. The memory module includes a substrate with an edge connector comprising pins along an edge of the substrate, and at least one memory package mounted to the substrate and containing a memory die electrically connected to input/output leads located along the perimeter of the memory package and through which data signals are transmitted to and from the memory die. Data signal lines electrically connect a plurality of the input/output leads of the memory package to a plurality of the pins of the edge connector. Termination resistors individually electrically connect each of the data signal lines to ground, a supply voltage, or a reference voltage of the memory package so as to reduce noise and signal reflections through the data signal lines.

REFERENCES:
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patent: 6084425 (2000-07-01), Liaw et al.
patent: 6108212 (2000-08-01), Lach et al.
patent: 6266252 (2001-07-01), Karabatsos
patent: 6597277 (2003-07-01), Hellriegel
patent: 6737749 (2004-05-01), Tomsio et al.
patent: 6754129 (2004-06-01), Khatri et al.
patent: 6839241 (2005-01-01), Benisek et al.
patent: 2005/0002241 (2005-01-01), Park et al.
patent: 2005/0281096 (2005-12-01), Bhakta et al.

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