Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2005-01-04
2008-12-02
Norris, Jeremy C (Department: 2841)
Metal working
Method of mechanical manufacture
Electrical device making
C029S852000, C174S261000
Reexamination Certificate
active
07458149
ABSTRACT:
A wiring pattern can be formed with a high density on a substrate as a highly reliable printed circuit board. A method of manufacturing a printed circuit board includes a step of forming a conductive layer, which is to be used as a plating power supplying layer, on a substrate, a step of forming a first mask pattern for forming a predetermined wiring pattern on a surface of the conductive layer, carrying out electroplating with the conductive layer as the plating power supplying layer to form a conductive part on the conductive layer, and then removing the first mask pattern, and a step of forming a second mask pattern that exposes required parts of the conductive part on the substrate, on which the conductive part has been formed on the conductive layer, carrying out electroplating with the conductive layer as the plating power supplying layer to form protective plating on exposed parts of the conductive part, and then removing the second mask pattern.
REFERENCES:
patent: 6184476 (2001-02-01), Takahashi et al.
patent: 7226807 (2007-06-01), Okazawa et al.
patent: 2002-026172 (2002-01-01), None
patent: 2003-188496 (2003-07-01), None
Fujitsu Limited
Norris Jeremy C
Staas & Halsey , LLP
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