Substrate structure with embedded semiconductor chip and...

Details Substrate structure with embedded semiconductor chip and... Substrate structure with embedded semiconductor chip and...

2005-11-14

2008-11-04

Andujar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Smart card package

C438S121000, C257SE23064

Reexamination Certificate

active

07446402

ABSTRACT:
A substrate structure with embedded semiconductor chip and a fabrication method thereof are provided. The method includes: providing a carrier board having a first surface and an opposing second surface, wherein a first opening and an opposing second opening are formed in the first and second surfaces respectively, and a portion of the first opening communicates with the second opening; mounting at least one semiconductor chip to bottom of the first opening to be received in the first opening; filling an adhesive material in the first and second openings and in a gap between the chip and the carrier board to adhere the chip; forming a dielectric layer on the carrier board and the chip; and forming a circuit layer on the dielectric layer and forming conductive structures in the dielectric layer, so that the circuit layer is electrically connected to the chip via the conductive structures.

REFERENCES:
patent: 6081997 (2000-07-01), Chia et al.
patent: 6709898 (2004-03-01), Ma et al.
patent: 6872597 (2005-03-01), Takahashi et al.
patent: 6952049 (2005-10-01), Ogawa et al.
patent: 7087991 (2006-08-01), Chen et al.
patent: 2003/0227077 (2003-12-01), Towle et al.
patent: 2004/0168825 (2004-09-01), Sakamoto et al.
patent: 2005/0098879 (2005-05-01), Kim

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