Sensor module and method of manufacturing same

Details Sensor module and method of manufacturing same Sensor module and method of manufacturing same

2006-08-25

2008-11-04

Pham, Thanh V (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S015000, C438S025000, C438S026000, C438S051000, C438S064000, C438S106000, C438S107000, C257S778000, C257SE21318, C257SE21499, C257SE21503, C257SE21511

Reexamination Certificate

active

07445959

ABSTRACT:
The embodiments herein relate to sensor modules having sensor chips with a sensing region on a face thereof, and methods for their manufacture.

REFERENCES:
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patent: 6140144 (2000-10-01), Najafi et al.
patent: 6514782 (2003-02-01), Wierer et al.
patent: 6943423 (2005-09-01), Kim
patent: 2003/0052702 (2003-03-01), Auburger et al.
patent: 2005/0017374 (2005-01-01), Kiendl et al.
patent: 2005/0046044 (2005-03-01), Theuss
patent: 2006/0055309 (2006-03-01), Ono et al.
patent: 2006/0126313 (2006-06-01), Steiner et al.
patent: 2007/0090535 (2007-04-01), Kiendl et al.

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