Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
Reexamination Certificate
2005-05-24
2008-12-09
Louie, Wai-Sing (Department: 2814)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Thinning of semiconductor substrate
C438S022000, C438S048000, C438S963000
Reexamination Certificate
active
07462553
ABSTRACT:
Ultra thin back-illuminated photodiode array fabrication methods providing backside contact by diffused regions extending through the array substrate. In accordance with the methods, a matrix is diffused into one surface of a substrate, and at a later stage of the substrate processing, the substrate is reduced in thickness and a similar matrix is diffused into the substrate from the other side, this second diffusion being aligned with the first and contacting the first within the substrate. These two contacting matrices provide good electrical contact to a conductive diffusion on the backside for a low resistance contact to the backside. Various embodiments are disclosed.
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Goushcha Alexander O.
Metzler Richard A.
Blakely , Sokoloff, Taylor & Zafman LLP
Ingham John C
Louie Wai-Sing
Semicoa
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