Semiconductor device manufacturing: process – Making passive device – Stacked capacitor
Reexamination Certificate
2006-03-31
2008-11-25
Lee, Calvin (Department: 2892)
Semiconductor device manufacturing: process
Making passive device
Stacked capacitor
Reexamination Certificate
active
07456078
ABSTRACT:
The thin-film capacitor comprises a capacitor part20formed over a base substrate10and including a first capacitor electrode14, a capacitor dielectric film16formed over the first capacitor electrode14, and a second capacitor electrode18formed over the capacitor dielectric film16; leading-out electrodes26a,26blead from the first capacitor electrode14or the second capacitor electrode18and formed of a conducting barrier film which prevents the diffusion of hydrogen or water; and outside connection electrodes34a,34bfor connecting to outside and connected to the leading-out electrodes26a,26b.
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German Office Action dated Jan. 26, 2007, Application No. 10 2006 013 812.0-34.
Baniecki John David
Ishii Masatoshi
Kurihara Kazuaki
Shioga Takeshi
Fujitsu Limited
Lee Calvin
Westerman, Hattori, Daniels & Adrian , LLP.
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