Solderable pad with integral series termination resistor

Details Solderable pad with integral series termination resistor Solderable pad with integral series termination resistor

1998-02-04

1999-06-15

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257772, 257780, 361779, H01L 2348

Patent

active

059125071

ABSTRACT:
A microelectronic assembly, such as a surface-mount device or a ball-grid array (BGA) package, has one or more integral resistors. The integral resistors are incorporated into one or more of the microelectronic assembly's electrical leads or connections. The integral resistors preferably terminate in a solderable pad. For example, the BGA package may include an IC chip and interposer. A terminal is located on a surface of the IC chip, on a surface of the interposer, or on the surface of the substrate to which the BGA is mounted. An electrically-resistive material overlies the terminal and electrically couples the terminal to a bond pad, thereby defining an integral resistor. The integral resistors reduce electrical resonances and reflections that may otherwise degrade the signal integrity and reliability of the electrical system employing the device; hence, reduce or eliminate the requirement for discrete resistors for the microelectronic assembly.

REFERENCES:
patent: 5468995 (1995-11-01), Higgins

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