Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2006-11-20
2008-11-11
Dinh, Phuong K (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
07448880
ABSTRACT:
In the case where high speed differential signals are transmitted in differential transmission lines through via holes with open-stubs, signal waveforms are distorted due to impedance mismatch in the open-stubs of the via holes, thus causing jitter, which has become an issue of high speed signals. For differential transmission lines that pass through via holes with open-stubs, a degree of coupling of the lines is decreased while the differential characteristic impedance is made constant. Thereby, the effects of backward cross talk noise caused by the coupling can be minimized, and thus jitter can be suppressed.
REFERENCES:
patent: 5003273 (1991-03-01), Oppenberg
patent: 5381596 (1995-01-01), Ferro
patent: 6812803 (2004-11-01), Goergen
patent: 7152319 (2006-12-01), Chan et al.
patent: 2004/0150969 (2004-08-01), Chan et al.
patent: 2004-235629 (2004-01-01), None
A. Marquez, Esq. Juan Carlos
Dinh Phuong K
Fisher Esq. Stanley P.
Hitachi , Ltd.
Reed Smith LLP
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