Connection for flex circuit and rigid circuit board

Electrical connectors – Metallic connector or contact having part permanently... – Adapted to be secured to conductor formed on printed circuit...

Reexamination Certificate

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Details

C439S067000, C174S08800C, C361S758000

Reexamination Certificate

active

07448923

ABSTRACT:
Conductive pads of a flex circuit may be electrically connected to conductive pads of a rigid circuit board. The conductive pads of the flex circuit may be sized, configured and alignable to the conductive pads of the rigid circuit board. A spacer with a plurality of apertures may be sized, configured and aligned to the conductive pads of the flex circuit and the rigid circuit board. Solder paste may be disposed between respective conductive pads of the flex circuit and the rigid circuit board within the apertures of the spacer. When the flex circuit, rigid circuit board and the spacer are assembled, the solder paste is displaced through relief vents formed through the conductive pads of the flex circuit, rigid circuit board or both the flex circuit or rigid circuit board. The solder paste is reflowed and forms a rivet structure attaching the flex circuit to the rigid circuit board as well as providing an electrical connection between the conductive pads of the flex circuit and the rigid circuit board.

REFERENCES:
patent: 3541225 (1970-11-01), Raciti
patent: 3905665 (1975-09-01), Lynch et al.
patent: 4394712 (1983-07-01), Anthony
patent: 5132879 (1992-07-01), Chang et al.
patent: 5570504 (1996-11-01), DiStefano et al.
patent: 5617300 (1997-04-01), Anzawa et al.
patent: 5688584 (1997-11-01), Casson et al.
patent: 5896276 (1999-04-01), Tamura et al.
patent: 6347042 (2002-02-01), White
patent: 2001/0053068 (2001-12-01), Murayama et al.
Patent Cooperation Treaty. International Search Report. International Application No. PCT/US2007/019969. 12 pages.

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