Probe card and testing method of semiconductor chip,...

Details Probe card and testing method of semiconductor chip,... Probe card and testing method of semiconductor chip,...

2006-07-14

2008-12-16

Hollington, Jermele M (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

07466152

ABSTRACT:
A probe card including probes, a build-up interconnection layer having a multilayer interconnection structure therein and carrying the probes on a top surface in electrical connection with the multilayer interconnection structure, and a capacitor provided on the build-up interconnection layer in electrical connection with one of the probes via the multilayer interconnection structure, wherein the multilayer interconnection structure includes an inner via-contact in the vicinity of the probe and the capacitor is embedded in a resin insulation layer constituting the build-up layer.

REFERENCES:
patent: 3932810 (1976-01-01), Kohler et al.
patent: 4862077 (1989-08-01), Horel et al.
patent: 4928061 (1990-05-01), Dampier et al.
patent: 5023750 (1991-06-01), Hirayama
patent: 5047817 (1991-09-01), Wakamiya et al.
patent: 5313157 (1994-05-01), Pasiecznik, Jr.
patent: 5748006 (1998-05-01), Sano
patent: 5786242 (1998-07-01), Takemura et al.
patent: 5917330 (1999-06-01), Miley
patent: 5983493 (1999-11-01), Eldridge et al.
patent: 6218910 (2001-04-01), Miller
patent: 6278153 (2001-08-01), Kikuchi et al.
patent: 6358759 (2002-03-01), Hirabayashi
patent: 6548844 (2003-04-01), Fukuzumi et al.
patent: 6596571 (2003-07-01), Arao et al.
patent: 6599757 (2003-07-01), Murai
patent: 6655023 (2003-12-01), Eldridge et al.
patent: 6727579 (2004-04-01), Eldridge et al.
patent: 6800889 (2004-10-01), Takatani et al.
patent: 6818469 (2004-11-01), Mori et al.
patent: 6897544 (2005-05-01), Ooi et al.
patent: 6911835 (2005-06-01), Chraft et al.
patent: 6967557 (2005-11-01), Hagios et al.
patent: 7102367 (2006-09-01), Yamagishi et al.
patent: 2001/0041392 (2001-11-01), Suzawa et al.
patent: 2002/0016028 (2002-02-01), Arao et al.
patent: 2002/0123158 (2002-09-01), Murai
patent: 2006/0055021 (2006-03-01), Yamamoto
patent: 0 840 133 (1998-05-01), None
patent: 07-111280 (1995-04-01), None
patent: 10-132855 (1998-05-01), None
patent: 2001-88294 (2001-04-01), None
patent: 2001-267751 (2001-09-01), None
patent: 2003-501819 (2003-01-01), None
Chinese Office Action mailed May 9, 2008, with English-language translation thereof.

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