Probe card and testing method of semiconductor chip,...

Details Probe card and testing method of semiconductor chip,... Probe card and testing method of semiconductor chip,...

2006-07-14

2008-11-11

Hollington, Jermele M (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

07449900

ABSTRACT:
A probe card including probes, a build-up interconnection layer having a multilayer interconnection structure therein and carrying the probes on a top surface in electrical connection with the multilayer interconnection structure, and a capacitor provided on the build-up interconnection layer in electrical connection with one of the probes via the multilayer interconnection structure, wherein the multilayer interconnection structure includes an inner via-contact in the vicinity of the probe and the capacitor is embedded in a resin insulation layer constituting the build-up layer.

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Chinese Office Action mailed May 9, 2008 with English-language translation thereof.

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