Support of deep power savings mode and partial good in a...

Details Support of deep power savings mode and partial good in a... Support of deep power savings mode and partial good in a...

2006-06-21

2008-12-02

Masinick, Michael D (Department: 2128)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Specific application of temperature responsive control system

C700S292000, C374S100000, C374S116000, C374S142000, C374S163000, C374S170000, C361S093800, C438S122000, C438S308000

Reexamination Certificate

active

07460932

ABSTRACT:
A computer implemented method, data processing system, and processor are provided for managing a thermal management system. A determination is made as to whether a plurality of digital thermal sensors is faulty or functional. A power savings mode of at least one unit within the integrated circuit associated with the functional digital thermal sensor is monitored in response to at least one of the plurality of digital thermal sensors being functional. A functional digital thermal sensor is disabled in response to the at least one unit being in a power savings mode.

REFERENCES:
patent: 4497031 (1985-01-01), Froehling et al.
patent: 5175852 (1992-12-01), Johnson et al.
patent: 5469560 (1995-11-01), Beglin
patent: 5778384 (1998-07-01), Provino et al.
patent: 5953536 (1999-09-01), Nowlin, Jr.
patent: 6029119 (2000-02-01), Atkinson
patent: 6393374 (2002-05-01), Rankin et al.
patent: 6564328 (2003-05-01), Grochowski et al.
patent: 6630754 (2003-10-01), Pippin
patent: 6654894 (2003-11-01), Kaminski et al.
patent: 6760649 (2004-07-01), Cohen
patent: 6776817 (2004-08-01), Lentz et al.
patent: 6789037 (2004-09-01), Gunther et al.
patent: 6908227 (2005-06-01), Rusu et al.
patent: 6909922 (2005-06-01), Tymchenko
patent: 6974252 (2005-12-01), Bowden et al.
patent: 6975047 (2005-12-01), Pippin
patent: 6980918 (2005-12-01), Gunther et al.
patent: 7050959 (2006-05-01), Pollard et al.
patent: 7149645 (2006-12-01), Mangrulkar et al.
patent: 7158911 (2007-01-01), Gunther et al.
patent: 7370242 (2008-05-01), Chen et al.
patent: 7376532 (2008-05-01), Johns et al.
patent: 2002/0065049 (2002-05-01), Chauvel et al.
patent: 2003/0014587 (2003-01-01), Bouvier et al.
patent: 2003/0110012 (2003-06-01), Orenstien et al.
patent: 2003/0158697 (2003-08-01), Gold et al.
patent: 2003/0177107 (2003-09-01), Brown et al.
patent: 2003/0229662 (2003-12-01), Luick
patent: 2005/0216222 (2005-09-01), Inoue
patent: 2005/0216775 (2005-09-01), Inoue
patent: 2005/0228618 (2005-10-01), Patel et al.
patent: 2005/0246558 (2005-11-01), Ku
patent: 2005/0278520 (2005-12-01), Hirai et al.
patent: 2006/0005083 (2006-01-01), Genden et al.
patent: 2006/0041766 (2006-02-01), Adachi
patent: 2006/0101289 (2006-05-01), Dang et al.
patent: 2007/0074011 (2007-03-01), Borkar et al.
patent: 2007/0121492 (2007-05-01), Johns et al.
patent: 2007/0121698 (2007-05-01), Johns et al.
patent: 2007/0121699 (2007-05-01), Johns et al.
patent: 2007/0124104 (2007-05-01), Johns et al.
patent: 2007/0124105 (2007-05-01), Johns et al.
patent: 2007/0124611 (2007-05-01), Johns et al.
patent: 2007/0124622 (2007-05-01), Johns et al.
patent: 2007/0191993 (2007-08-01), Wyatt
patent: 2007/0198134 (2007-08-01), Adachi et al.
patent: 2008/0103634 (2008-05-01), Santos et al.
patent: 1182538 (2002-02-01), None
patent: 1783608 (2007-05-01), None
patent: 2005093564 (2005-10-01), None
patent: 2005124550 (2005-12-01), None
“Thermal Management for High Performance Integrated Circuits With Non-Uniform Chip Power COnsiderations”, Yuan et al, IBM Research Devision, IEEE 2001.
“A Self-Consistent Substrate Thermal Profile Estimation Technique for Nanoscale ICs-Part 1: ELectrothermal Couplints and Full Chip Package Thermal Model”, Lin et al, IEEE Transactions on Electron Devices, Dec. 2007.
Design of Bulk Thermoelectric Modules for Integrated Circuit Thermal Management, Fukutani et al, IEEE Transactions on Components and Packaging Technologies, vol. 29 No. 4, Dec. 2006.
“Enablling Technologies for Integrated System-on-a-Package for the next generation Aerospace Applications”, Young et al, University of Arkansas Department of Mechanical Engineering.
“Overview of the Architecture, Circuit Design, and Physical Implementation of a First-Generation Cell Processor”, Pham et al, IEEE Journal of Solid-State Circuits, vol. 41 No. 1, Jan. 2006.
U.S. Appl. No. 11/289,248, filed Nov. 29, 2005, Aguilar, Jr. et al.
U.S. Appl. No. 11/289,083, filed Nov. 29, 2005, Aguilar, Jr. et al.
U.S. Appl. No. 11/289,066, filed Nov. 29, 2005, Aguilar, Jr. et al.
U.S. Appl. No. 11/289,088, filed Nov. 29, 2005, Aguilar, Jr. et al.
U.S. Appl. No. 11/289,089, filed Nov. 29, 2005, Aguilar, Jr. et al.
U.S. Appl. No. 11/289,090, filed Nov. 29, 2005, Aguilar, Jr. et al.
U.S. Appl. No. 11/381,373, filed May 3, 2006, Aguilar, Jr. et al.
U.S. Appl. No. 11/381,380, filed May 3, 2006, Aguilar, Jr. et al.
U.S. Appl. No. 11/381,386, filed May 3, 2006, Aguilar, Jr. et al.
U.S. Appl. No. 11/381,391, filed May 3, 2006, Aguilar, Jr. et al.
http://www.m-w.com/dictionary/sense pp. 1-2 retrieved Dec. 11, 2006.
http://en.wikipedia.org/wiki/Central—processing—unit, pp. 1-13, retrieved Dec. 26, 2006.
U.S. Appl. No. 11/425,453, filed Jun. 21, 2006, Johns et al.
U.S. Appl. No. 11/425,455, filed Jun. 21, 2006, Johns et al.
U.S. Appl. No. 11/425,459, filed Jun. 21, 2006, Johns et al.
U.S. Appl. No. 11/425,472, filed Jun. 21, 2006, Johns et al.
U.S. Appl. No. 11/425,483, filed Jun. 21, 2006, Johns et al.
U.S. Appl. No. 11/425,492, filed Jun. 21, 2006, Johns et al.
U.S. Appl. No. 11/425,499, filed Jun. 21, 2006, Johns et al.
Smith, “Measuring temperatures on computer chips with speed and accuracy”, Analog Dialogue 33-4, (1999 Analog Devices), pp. 1-5.

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