Semiconductor device with conductive oxidation preventing film a

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257412, 257757, 438653, 438656, H01L 2348, H01L 2352, H01L 2940, H01L 2976

Patent

active

059071885

ABSTRACT:
A semiconductor device includes a semiconductor substrate, and a laminated film insulatively formed over the semiconductor substrate, wherein the laminated film includes a semiconductor film, a metal film of refractory metal formed on the semiconductor film, a conductive oxidation preventing film disposed between the metal film and the semiconductor film, for preventing oxidation of the semiconductor film in an interface between the metal film and the semiconductor film, and an oxide film formed on a side surface of the semiconductor film and formed to extend into upper and lower portions of the semiconductor film in a bird's beak form.

REFERENCES:
patent: 5341016 (1994-08-01), Prall et al.
patent: 5573965 (1996-11-01), Chen et al.
patent: 5576579 (1996-11-01), Agnello et al.
"Ti-Si-N Diffusion Barriers Between Silicon and Copper," J. S. Reid et al. IEEE Electron Device Letters, vol. 15, No. 8, Aug. 1994; pp. 298-300.
"A Nitride-Isolated Molybdenum-Polysilicon Gate Electrode For MOS VLSI Circuits," Takashi I to et al. IEEE Transactions On Electron Devices, vol. ED-33, No. 4, Apr. 1986; pp. 464-468.
"Sputtered Ta-Si-N Diffusion Barriers In Cu Metallizations For Si," E. Kolawa et al. IEEE Electron Device Letters, vol. 12, No. 6, Jun. 1991; pp. 321-323.
"An Inexpensive Diffusion Barrier Technology For Polycide Gate Electrodes With An SiN Layer Formed With ECR Nitrogen Plasma," Tetsuo Hosoya et al. Extended Abstracts Of The 1994 International Conference On Solid State Devices And Materials, Aug. 23, 1994; pp. 422-424.
Extended Abstracts (The 41st Spring Meeting, 1994). The Japan Society Of Applied Physics And Related Societies, S. Suehiro et al.; p. 684.
Extended Abstracts (The 41st Spring Meeting, 1994). The Japan Society Of Applied Physics And Related Societies, Y. Akasaka et al.; p. 684.
"Low-Resistivity Poly-Metal Gate Electrode Durable For High-Temperature Processing," Y. Akasaka et al. Proc. Of 12th VLSI Multilevel Interconnection Conference, Jun. 27-29, 1995; pp. 168-174.
Poly-Metal Gate Process--Ultrathin WSiN Barrier Layer Impermeable To Oxidant In-Diffusion During Si Selective Oxidation, K. Nakajima et al., Proc. Adv. Metalization For ULSI p., 51, Oct. 23, 1995.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device with conductive oxidation preventing film a does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device with conductive oxidation preventing film a, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device with conductive oxidation preventing film a will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-402755

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.