Method and system for detecting tilt or shift of wafer...

Details Method and system for detecting tilt or shift of wafer... Method and system for detecting tilt or shift of wafer...

2007-04-05

2008-11-18

Raymond, Edward (Department: 2857)

Data processing: measuring, calibrating, or testing

Measurement system

Temperature measuring system

C374S006000

Reexamination Certificate

active

07454307

ABSTRACT:
A method for detecting a tilt or a shift of a wafer on a hot plate is described. A temperature variation of the hot plate is measured directly after the wafer is transferred onto the hot plate. The temperature variation is analyzed to determine whether or not a tilt or a shift of the wafer has occurred.

REFERENCES:
patent: 6954275 (2005-10-01), Choi et al.

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