Laser machining apparatus, and apparatus and method for...

Electric heating – Metal heating – By arc

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C219S121710, C219S121830

Reexamination Certificate

active

07456372

ABSTRACT:
There is provided a laser processing apparatus, a multilayer printed wiring board manufacturing apparatus, and a manufacturing method to form via holes of ultra-fine diameter. The laser beam from the CO2laser oscillator (60) is converted to the shortened wavelength beam by a tellurium crystal (94) to control diffraction of the laser beam. Simultaneously, when the laser beam is condensed, a limit value of the condensation limit is reduced. Thereby, the spot diameter of laser beam is reduced and a hole for via hole is bored on the interlayer insulation resin on a substrate (10). Therefore, even when the laser beam output is raised to form a deeper hole, the hole diameter is not widened and thereby a hole for a small diameter via hole can be formed.

REFERENCES:
patent: 3792287 (1974-02-01), Roland et al.
patent: 4708545 (1987-11-01), Fujii et al.
patent: 4720798 (1988-01-01), Reed et al.
patent: 4761561 (1988-08-01), Fujiwara et al.
patent: 4852115 (1989-07-01), Viherkoski
patent: 4979180 (1990-12-01), Munchervan
patent: 5010232 (1991-04-01), Arai et al.
patent: 5063280 (1991-11-01), Inagawa et al.
patent: 5073687 (1991-12-01), Inagawa et al.
patent: 5111406 (1992-05-01), Zachman et al.
patent: 5144681 (1992-09-01), Kitakado et al.
patent: 5191699 (1993-03-01), Ganslmeier et al.
patent: 5227013 (1993-07-01), Kumar
patent: 5250843 (1993-10-01), Eichelberger
patent: 5266380 (1993-11-01), Renguso et al.
patent: 5282312 (1994-02-01), DiStefano et al.
patent: 5294975 (1994-03-01), Norman et al.
patent: 5298717 (1994-03-01), DeRossett, Jr.
patent: 5318160 (1994-06-01), Oomi et al.
patent: 5337151 (1994-08-01), Baxter et al.
patent: 5355247 (1994-10-01), Byer et al.
patent: 5377404 (1995-01-01), Berg
patent: 5393359 (1995-02-01), Chang et al.
patent: 5401909 (1995-03-01), Arnold et al.
patent: 5430816 (1995-07-01), Furuya et al.
patent: 5522683 (1996-06-01), Kakimoto et al.
patent: 5529441 (1996-06-01), Kosmowski et al.
patent: 5532520 (1996-07-01), Haraguchi et al.
patent: 5548372 (1996-08-01), Schroeder et al.
patent: 5563730 (1996-10-01), Singh et al.
patent: 5582745 (1996-12-01), Hans et al.
patent: 5640761 (1997-06-01), DiStefano et al.
patent: 5655030 (1997-08-01), Suzuki
patent: 5670067 (1997-09-01), Koide et al.
patent: 5690846 (1997-11-01), Okada et al.
patent: 5751585 (1998-05-01), Cutler et al.
patent: 5764485 (1998-06-01), Lebaschi
patent: 5768107 (1998-06-01), Ouchi et al.
patent: 5780807 (1998-07-01), Saunders
patent: 5811754 (1998-09-01), Nakatani et al.
patent: 5841099 (1998-11-01), Owen et al.
patent: 5898227 (1999-04-01), Geffken et al.
patent: 6091026 (2000-07-01), Yang
patent: 6211485 (2001-04-01), Burgess
patent: 6256121 (2001-07-01), Lizotte et al.
patent: 80651 (1983-06-01), None
patent: 0 223 066 (1987-05-01), None
patent: 426600 (1991-05-01), None
patent: 0 657 917 (1995-06-01), None
patent: 669792 (1995-08-01), None
patent: 59-189090 (1984-10-01), None
patent: 61-020683 (1986-01-01), None
patent: 61-33786 (1986-02-01), None
patent: 61-125715 (1986-06-01), None
patent: 62-4503 (1987-01-01), None
patent: 62-24906 (1987-02-01), None
patent: 02-054996 (1990-02-01), None
patent: 02-170595 (1990-07-01), None
patent: 03-011571 (1991-01-01), None
patent: 3-50372 (1991-05-01), None
patent: 3-268316 (1991-11-01), None
patent: 04-073996 (1992-03-01), None
patent: 4-115517 (1992-04-01), None
patent: 04-157470 (1992-05-01), None
patent: 4-356389 (1992-12-01), None
patent: 05-21398 (1993-08-01), None
patent: 05-318160 (1993-12-01), None
patent: 06-120683 (1994-04-01), None
patent: 06-269969 (1994-09-01), None
patent: 7-32183 (1995-02-01), None
patent: 7-171796 (1995-07-01), None
patent: 7-273458 (1995-10-01), None
patent: 07-290396 (1995-11-01), None
patent: 8-153976 (1996-06-01), None
patent: 08-340165 (1996-12-01), None
patent: 09-248688 (1997-09-01), None
patent: 09-308983 (1997-12-01), None
patent: WO 96/02351 (1996-02-01), None
Takeno et al., “Laser Drilling by High Peak Laser Pulsed CO2 Laser”,Oct. 1992, ICALEO Laser Materials Processing—Proceedings of SPIE, The International Society for Optical Engineering, vol. 1990, pp. 459-468.
“Electronic Material,” vol. 10, Aug. 1, 1996, 10 pages.
“Electronic Material,” vol. 4, Apr. 1, 1996, 12 pages.
Notice of Shipment and Delivery, dated Sep. 19, 1996, 5 pages.
Report on the Completion of a Laser Processing Machine, date Sep. 1996, 3 pages.
Mitsubishi ML505GT Catalog, Jun. 1996, 2 pages.
Mitsubishi LCP1 Specification, Sep. 1996, pp. 1-43.
Mitsubishi LCP1 Supplemental Specification, Sep. 1996, pp. 1-20.
Specification on Mitsubishi Carbon Dioxide Gas Laser Processing Machine, MLG505GT-5003D, Aug. 1996, pp. 1-11.
List on Calculation Program of M303 work gap, undated, 38 pages.
Patent Abstracts of Japan, JP 08-153976, Jun. 11, 1996.
Patent Abstracts of Japan, JP 07-273458, Oct. 20, 1995.
Patent Abstracts of Japan, JP 04-356389, Dec. 10, 1992.
Patent Abstracts of Japan, JP 07-032183, Feb. 3, 1995.
Patent Abstracts of Japan, JP 04-351280, Dec. 7, 1992.
Patent Abstracts of Japan, JP 02-217186, Aug. 29, 1990.
Patent Abstracts of Japan, JP 03-054884, Mar. 8, 1991.
U.S. Appl. No. 09/101,833, filed Jan. 29, 1999, Hiramatsu.
U.S. Appl. No. 10/863,753, filed Jun. 9, 2004, Hiramatsu.
U.S. Appl. No. 10/923,037, filed Aug. 23, 2004, Hiramatsu.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Laser machining apparatus, and apparatus and method for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Laser machining apparatus, and apparatus and method for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laser machining apparatus, and apparatus and method for... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4024293

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.