Laser apparatus and method for assembling the same

Details Laser apparatus and method for assembling the same Laser apparatus and method for assembling the same

2006-03-22

2008-12-16

Nguyen, Cuong Q (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S098000

Reexamination Certificate

active

07466017

ABSTRACT:
A laser apparatus includes: one or more semiconductor lasers emitting one or more laser beams; an optical fiber; an optical condensing system which makes the one or more laser beams enter the optical fiber from a light-entrance end of the optical fiber; and a package which fixedly contains the optical condensing system and the one or more semiconductor lasers, and fixedly holds the optical fiber in such a manner that the light-entrance end faces the optical condensing system. The one or more semiconductor lasers are directly or indirectly fixed to the package with solder, and the one or more optical components are directly or indirectly fixed to the package with a thin layer of adhesive having a thickness of less than or equal to 1 micrometer, and preferably a thickness within a range of 0.2 micrometers to 1 micrometer after being dried.

REFERENCES:
patent: 7101094 (2006-09-01), Nagano et al.
patent: 7376162 (2008-05-01), Nagano et al.
patent: 0 631 164 (1994-12-01), None
patent: 2003-347647 (2003-12-01), None
patent: 2004-45667 (2004-02-01), None

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