Method of processing substrate and substrate processing...

Drying and gas or vapor contact with solids – Process – With nondrying treating of material

Reexamination Certificate

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Details

C034S090000

Reexamination Certificate

active

07437834

ABSTRACT:
A substrate processing apparatus10including a vapor generating unit371which generates a mixed gas consisting of an organic solvent vapor and an inert gas by bubbling the inert gas in the organic solvent; support means for supporting a plurality of substrates to be vertically arranged in parallel at equal pitches; a processing vessel15which accommodates multiple substrates supported by the support means; a lid30for covering the upper opening of the processing vessel; jet nozzles33provided in the lid30; and first piping3712, 342, 3421, and3422which causes the vapor generating unit and the jet nozzles to communicate with each other. In the substrate processing apparatus10, the first piping and the jet nozzles are respectively equipped with heaters, and the heaters are controlled by means of dry gas containing organic solvent mists of submicron size being emitted from the jet nozzles. According to the invention, Since micro-size organic solvent vapor is used, the substrate processing method and apparatus of the invention ensures not only high-quality surface processing but also the reduction of processing time.

REFERENCES:
patent: 5950328 (1999-09-01), Ichiko et al.
patent: 6244575 (2001-06-01), Vaartstra et al.
patent: 10-118586 (1998-05-01), None
patent: 11-191549 (1999-07-01), None
patent: 2000-55543 (2000-02-01), None
patent: 2002-134461 (2002-05-01), None
patent: 2002-359221 (2002-12-01), None

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