Conductive particle and adhesive agent

Details Conductive particle and adhesive agent Conductive particle and adhesive agent

2003-03-25

2008-08-19

Kopec, Mark (Department: 1796)

Compositions

Electrically conductive or emissive compositions

Free metal containing

C252S513000, C252S514000, C428S403000, C428S407000

Reexamination Certificate

active

07413686

ABSTRACT:
A conductive particle can be used for connecting a variety of adherends. The conductive particle includes a resin particle, a first conductive particle disposed around the resin particle, a first resin coating disposed on the periphery of the resin particle. The first resin coating being softer than the resin particle. A second conductive thin film is disposed therearound. When the surface part of an electrode of an adherend that is to be connected is hard, a first resin coating of the conductive particle and the second conductive thin film are destroyed by pressure to bring the second conductive thin film in contact with the electrode and a metal wiring. If the surface part of the electrode is soft, the second conductive thin film on the surface side comes in contact with the electrode, which makes it possible for the particle to be used regardless of the surface state of an adherend.

REFERENCES:
patent: 6344156 (2002-02-01), Yamada et al.
patent: 6344272 (2002-02-01), Oldenburg et al.
patent: 2001/0055685 (2001-12-01), Kaneyoshi
patent: 7-50104 (1995-02-01), None
patent: 8-249922 (1996-09-01), None
patent: 2000-195339 (2000-07-01), None
patent: 2000-306428 (2000-11-01), None
patent: 2001-11503 (2001-01-01), None

Affiliated with

Also associated with

Rating

Conductive particle and adhesive agent does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Conductive particle and adhesive agent, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive particle and adhesive agent will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4018614