Method and apparatus for scanning, stitching, and damping...

Optics: measuring and testing – Inspection of flaws or impurities – Surface condition

Reexamination Certificate

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C356S237500, C356S237200

Reexamination Certificate

active

07436506

ABSTRACT:
A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching the scans together, thereby providing both damping of the specimen and the need for smaller and less expensive optical elements.

REFERENCES:
patent: 4335313 (1982-06-01), Kreuzer et al.
patent: 4659172 (1987-04-01), Cavan
patent: 4999511 (1991-03-01), Kohno
patent: 5086477 (1992-02-01), Yu et al.
patent: 5359407 (1994-10-01), Suzuki et al.
patent: 5381225 (1995-01-01), Kohno
patent: 5481202 (1996-01-01), Frye, Jr.
patent: 5495097 (1996-02-01), Katz et al.
patent: 5712890 (1998-01-01), Spivey et al.
patent: 5790932 (1998-08-01), Komaki et al.
patent: 5917590 (1999-06-01), Greve
patent: 5970168 (1999-10-01), Montesanto et al.
patent: 6113056 (2000-09-01), Armstrong
patent: 6204917 (2001-03-01), Smedt
patent: 6252705 (2001-06-01), Lo et al.
patent: 6414752 (2002-07-01), Sullivan et al.
patent: 544957 (1993-06-01), None
patent: 9727452 (1997-07-01), None

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