Method for centering a sputter target onto a backing plate...

Details Method for centering a sputter target onto a backing plate... Method for centering a sputter target onto a backing plate...

2003-09-26

2008-10-07

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Process

With shaping

C228S245000

Reexamination Certificate

active

07431195

ABSTRACT:
A method for aligning the sputter target onto a backing plate having a peripheral arcuate-shaped flange on its bonding surface to provide an aligned and uniform solder bonded interface; and the sputter target/backing plate assembly so produced.

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