Method for concave grinding of wafer and...

Details Method for concave grinding of wafer and... Method for concave grinding of wafer and...

2007-03-12

2008-08-19

Nguyen, Dung Van (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S058000

Reexamination Certificate

active

07413501

ABSTRACT:
To facilitate handling of a wafer with its thickness reduced by grinding its rear surface, and prevent any protrusions and depressions matching those of the front surface from being formed on its rear surface, the method including the steps of disposing an unevenness absorbing pad between a chuck table and a device region of the wafer for absorbing unevenness of the device region, and causing the wafer held by the chuck table to be rotated and ground, while having a grindstone kept in contact with rear surface of the wafer at center of rotation of the wafer, and out of contact with a portion of its rear surface opposite from the outer excess region, thereby forming a concavity in the portion of the rear surface of the wafer opposite from the device region, and forming an annular reinforcing portion including the outer excess region around the concavity.

REFERENCES:
patent: 5871393 (1999-02-01), Shiozawa
patent: 6527627 (2003-03-01), Arai
patent: 6702652 (2004-03-01), Arai
patent: 6780091 (2004-08-01), Mizomoto et al.
patent: 6837776 (2005-01-01), Shimobeppu et al.
patent: 2006/0244096 (2006-11-01), Sekiya
patent: 2004-319885 (2004-11-01), None

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