Molding manufacturing method and apparatus

Plastic and nonmetallic article shaping or treating: processes – Direct application of electrical or wave energy to work – Reshaping – drawing or stretching

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C264S172150, C264S320000, C264S319000

Reexamination Certificate

active

07416693

ABSTRACT:
A molding manufacturing method includes: preparing a molding body including a molding main body made of thermoplastic material and a decorative layer higher than the molding main body in hardness and melt temperature; setting the molding body in a fixed die; heating and softening an end portion of the molding body while maintaining the decorative layer softer than the molding main body, by irradiating an infrared ray onto a back surface of the molding main body corresponding to the end portion; and press forming the end portion of the molding body by applying a movable punch onto the fixed die while the end portion of the molding body is in a softened state to bend the end portion of the molding body to obtain an end cover portion having a predetermined shape.

REFERENCES:
patent: 2500895 (1950-03-01), Davies
patent: 3553301 (1971-01-01), Reardon et al.
patent: 3655173 (1972-04-01), Costello
patent: 3830680 (1974-08-01), Loy
patent: 4035224 (1977-07-01), Anderson
patent: 4385090 (1983-05-01), Sims
patent: 4864786 (1989-09-01), Harris, Jr.
patent: 6186765 (2001-02-01), Ide et al.
patent: 03-274587 (1991-12-01), None
patent: 09-254277 (1997-09-01), None
patent: 98-6152 (1998-09-01), None
patent: 11-105157 (1999-04-01), None
patent: 11-156878 (1999-06-01), None
patent: 11-235751 (1999-08-01), None
patent: 11-240034 (1999-09-01), None
patent: 2966315 (1999-10-01), None
patent: 2000-280834 (2000-10-01), None
patent: 2001-088155 (2001-04-01), None
Japanese Office Action mailing date: Oct. 4, 2005 with English translation issued for corresponding Japanese Application No. JP-A-2002-342649.
Japanese Office Action mailing date: Oct. 4, 2005 with English translation issued for corresponding Japanese Application No. JP-A-2002-342648.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Molding manufacturing method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Molding manufacturing method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molding manufacturing method and apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4011231

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.