Semiconductor chip, electrically connections therefor

Details Semiconductor chip, electrically connections therefor Semiconductor chip, electrically connections therefor

2005-06-30

2008-10-07

Ngo, Ngan (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Beam leads

C257S750000, C257S773000, C257S776000, C257SE23014

Reexamination Certificate

active

07432594

ABSTRACT:
A semiconductor device has a semiconductor chip including first and second surfaces opposed to each other in a thickness direction of the semiconductor chip, wherein the first and second surfaces include first and second electrode surfaces respectively, and first and second electrically conductive members covering the first and second electrode surfaces respectively as seen in the thickness direction to be electrically connected to the first and second electrode surfaces respectively.

REFERENCES:
patent: 2003/0122232 (2003-07-01), Hirano et al.
patent: 2005/0077599 (2005-04-01), Miura et al.
patent: 2003-086737 (2003-03-01), None

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