Cooling of substrate using interposer channels

Details Cooling of substrate using interposer channels Cooling of substrate using interposer channels

2004-09-02

2008-10-14

Reichard, Dean A. (Department: 2841)

Metal working

Method of mechanical manufacture

Electrical device making

C174S252000

Reexamination Certificate

active

07434308

ABSTRACT:
A structure, and method of forming and cooling the structure. The structure may include a substrate (e.g., a semiconductor chip) having N continuous substrate channels and an interposer having N continuous interposer channels (N≧2). The N interposer channels are coupled to the N substrate channels to form M continuous loops (1≦M≦N). The M loops may transfer heat from a heat source within the substrate to the interposer and then to a heat sink thermally coupled to the interposer. The structure may include an interposer having a thermally conductive enclosure surrounding a cavity. The cavity contains a thermally conductive foam material (e.g., graphite foam). The foam material contains a serpentine channel having contiguously connected channel segments. The serpentine channel may transfer heat from a heat source within a substrate (e.g., a semiconductor chip) to the interposer and then to a heat sink thermally coupled to the interposer.

REFERENCES:
patent: 4921041 (1990-05-01), Akachi
patent: 5219020 (1993-06-01), Akachi
patent: 5490558 (1996-02-01), Akachi
patent: 5697428 (1997-12-01), Akachi

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