Resin composition for optical wiring, and optoelectronic...

Details Resin composition for optical wiring, and optoelectronic... Resin composition for optical wiring, and optoelectronic...

2007-03-05

2008-10-28

Song, Sarah (Department: 2874)

Optical waveguides

Having particular optical characteristic modifying chemical...

Of waveguide core

C385S014000

Reexamination Certificate

active

07444058

ABSTRACT:
This invention is a resin composition for optical wiring, comprising an inorganic filler with an average particle size of 1 nm to 100 nm and a resin, having a ratio nf
r(where nfis the refractive index of the inorganic filler and nris the refractive index of the resin) of 0.8 to 1.2, a thermal expansion coefficient of −1×10−5/° C. to 4×10−5/° C., and a true dependency value of its refractive index on the temperature of −1×10−4/° C. to 1×10−4/° C. in a temperature range from −20° C. to 90° C., and substantially incapable of absorbing light in a wavelength range from 0.6 to 0.9 μm or from 1.2 to 1.6 μm. This invention also provides an optoelectronic circuit board.

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