Heat dissipation device

Details Heat dissipation device Heat dissipation device

2007-07-12

2008-10-28

Datskovskiy, Michael V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S689000, C361S698000, C361S699000, C361S700000, C361S704000, C165S080300, C165S080400, C165S104210, C165S104330, C165S121000, C165S185000

Reexamination Certificate

active

07443677

ABSTRACT:
A heat dissipation device comprises a first heat sink (10) for thermally contacting with an electronic device, a second heat sink (20) mounted on the first heat sink, heat pipes (40) connecting with both the first and second heat sinks. The heat pipes surround an entire periphery of the first heat sink and a part of the second heat sink. Each heat pipe comprises an evaporating portion (42), a first condensing portion (46) and a second condensing portion (44). The first and second condensing portions extend from two opposite ends of the evaporating portion respectively. The evaporating portion is positioned adjacent to the electronic device and the two condensing portions extend inwardly and bend in opposite directions to each other. The first condensing portion extends through the first heat sink and the second condensing portion extends through the second heat sink.

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