Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2003-04-10
2008-08-19
Reichard, Dean A. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C174S261000
Reexamination Certificate
active
07414858
ABSTRACT:
A semiconductor device (100) comprising a semiconductor substrate (20) and a functional element (31), such as a microstrip, an inductor, a coupler or the like, is provided. Herein the functional element (31) is—at least partially—present in a conductive patterned layer that is mechanically embedded in isolating material (40) and that is connected to the substrate (20) through connection means. In this way, electrical losses through the substrate (20) are substantially reduced. The device (100) is provided in that a foil comprising the patterned layer and a carrier layer is applied to the substrate (20), after which the space between them is filled with the isolating material (40) and the carrier layer is removed.
REFERENCES:
patent: 4992764 (1991-02-01), Ayasli
patent: 5404571 (1995-04-01), Makowski
patent: 5635762 (1997-06-01), Gammand
patent: 5949140 (1999-09-01), Nishi et al.
patent: 6060968 (2000-05-01), Baltus
patent: 6563214 (2003-05-01), Yamada et al.
patent: 6608757 (2003-08-01), Bhatt et al.
patent: 6801438 (2004-10-01), Castro
patent: 6882544 (2005-04-01), Nakamura et al.
patent: 1 154 473 (2001-11-01), None
patent: 1 187 205 (2002-03-01), None
patent: WO 02/01631 (2002-03-01), None
patent: WO 03/017479 (2003-02-01), None
patent: WO 03/086037 (2003-10-01), None
patent: WO 03/105213 (2003-12-01), None
Belk Michael E.
Getachew Abiy
Im Paul
Koninklijke Philips Electronics , N.V.
Reichard Dean A.
LandOfFree
Method of manufacturing an electronic device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing an electronic device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing an electronic device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4006069