Semiconductor assembly having substrate with electroplated...

Details Semiconductor assembly having substrate with electroplated... Semiconductor assembly having substrate with electroplated...

2007-01-05

2008-08-12

Wilczewski, M. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S766000, C257S773000, C257S774000, C257S775000

Reexamination Certificate

active

07411303

ABSTRACT:
An apparatus comprising an insulating substrate having first and second surfaces and a plurality of metal-filled vias extending from the first to the second surface. The first and second surfaces have contact pads, each one comprising a connector stack to at least one of the vias. The stack comprises a seed metal layer in contact with the via metal capable of providing an adhesive and conductive layer for electroplating on its surface, a first electroplated support layer secured to the seed metal layer, a second electroplated support layer, and at least one reflow metal bonding layer on the second support layer. The electrolytic plating process produces support layers substantially pure (at least 99.0%), free of unwanted additives such as phosphorus or boron, and exhibiting closely controlled grain sizes. Reflow metal connectors provide attachment to chip contact pads and external parts.

REFERENCES:
patent: 4569729 (1986-02-01), Goto et al.
patent: 5051317 (1991-09-01), Solidum
patent: 5106461 (1992-04-01), Volfson et al.
patent: 5169680 (1992-12-01), Ting et al.
patent: 5487819 (1996-01-01), Everett
patent: 5707893 (1998-01-01), Bhatt et al.
patent: 6144100 (2000-11-01), Shen et al.
patent: 6383352 (2002-05-01), Shyu et al.
patent: 6426011 (2002-07-01), Katoh
patent: 6458223 (2002-10-01), Hans Thieme et al.
patent: 6620731 (2003-09-01), Farnworth et al.
patent: 6638847 (2003-10-01), Cheung et al.
patent: 6683380 (2004-01-01), Efland et al.
patent: 6852625 (2005-02-01), Shin et al.
patent: 6872590 (2005-03-01), Lee et al.
patent: 6915566 (2005-07-01), Abbott et al.
patent: 6924224 (2005-08-01), Egitto et al.
patent: 6936536 (2005-08-01), Sinha
patent: 6964887 (2005-11-01), Akagawa
patent: 7008867 (2006-03-01), Lei
patent: 7022609 (2006-04-01), Yamamoto et al.
patent: 7034401 (2006-04-01), Savastiouk et al.
patent: 2001/0033020 (2001-10-01), Stierman et al.
patent: 2002/0192939 (2002-12-01), Sugihara
patent: 2004/0113244 (2004-06-01), Shin et al.
patent: 2004/0124535 (2004-07-01), Chang
patent: 2004/0132279 (2004-07-01), Egitto et al.
patent: 2004/0166661 (2004-08-01), Lei
patent: 2005/0000821 (2005-01-01), White et al.
patent: 2006/0145359 (2006-07-01), Sunohara et al.
patent: 2006/0199383 (2006-09-01), Tachibana

Affiliated with

Also associated with

Rating

Semiconductor assembly having substrate with electroplated... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor assembly having substrate with electroplated..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor assembly having substrate with electroplated... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4005908