Semiconductor chip assembly with laterally aligned bumped...

Details Semiconductor chip assembly with laterally aligned bumped... Semiconductor chip assembly with laterally aligned bumped...

2006-11-27

2008-08-26

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S774000, C257S784000, C257S787000, C257SE23069

Reexamination Certificate

active

07417314

ABSTRACT:
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a filler, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line is adjacent to the bumped terminal and extends laterally beyond the bumped terminal and the filler, and the filler contacts the bumped terminal in a cavity that extends through the bumped terminal.

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