Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Contacting coating as it forms with solid member or material...
Reexamination Certificate
2004-06-18
2008-10-14
Tsang-Foster, Susy (Department: 1795)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Contacting coating as it forms with solid member or material...
C205S096000, C205S123000, C205S143000, C205S663000
Reexamination Certificate
active
07435323
ABSTRACT:
An apparatus which can control thickness uniformity during deposition of conductive material from an electrolyte onto a surface of a semiconductor substrate is provided. The apparatus has an anode which can be contacted by the electrolyte during deposition of the conductive material, a cathode assembly including a carrier adapted to carry the substrate for movement during deposition, and a conductive element permitting electrolyte flow therethrough. A mask lies over the conductive element and has openings permitting electrolyte flow. The openings define active regions of the conductive element by which a rate of conductive material deposition onto the surface can be varied. A power source can provide a potential between the anode and the cathode assembly so as to produce the deposition. A deposition process is also disclosed, and uniform electroetching of conductive material on the semiconductor substrate surface can additionally be performed.
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Basol Bulent M.
Lindquist Paul
Knobbe Martens Olson & Bear LLP
Leader William T
Novellus Systems Inc.
Tsang-Foster Susy
LandOfFree
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