Mounting substrate and its production method, and printed wiring

Details Mounting substrate and its production method, and printed wiring Mounting substrate and its production method, and printed wiring

1989-05-25

1991-05-28

Picard, Leo P.

Electricity: electrical systems and devices

Miscellaneous

361405, 361406, 361408, 174259, 174260, H05K 100

Patent

active

050199447

ABSTRACT:
This invention relates to a mounting substrate onto which components such as an IC chip are to be mounted, its production method, and a printed wiring board having a connector function suitable for a fine pitch and its connection method. Metal nodules are formed on conductors of connection portions by electrodeposition, or the like. Connection is made by fixing connection portions by an adhesive. Good conduction can be secured through the metal nodules and good insulation can be held between adjacent conductors.

REFERENCES:
patent: 4075420 (1978-02-01), Walton
patent: 4368281 (1983-01-01), Brummett
patent: 4694572 (1987-09-01), Leber et al.
patent: 4774634 (1988-09-01), Tate et al.
patent: 4818823 (1989-04-01), Bradley

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