Multi-layer polishing pad material for CMP

Details Multi-layer polishing pad material for CMP Multi-layer polishing pad material for CMP

2005-04-25

2008-10-14

Morgan, Eileen P. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S527000, C451S531000, C451S533000

Reexamination Certificate

active

07435161

ABSTRACT:
The invention is directed to a multi-layer polishing pad for chemical-mechanical polishing comprising a porous polishing layer and a porous bottom layer, wherein the bottom layer is substantially coextensive with the polishing layer, the polishing layer being joined to the bottom layer without the use of an adhesive; the polishing layer having an average surface roughness, Ra, that is greater than the Ra of the bottom layer.

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