Mounting apparatus for electronic device packages

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Patent

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Details

165 803, 174 163, H05K 720

Patent

active

050199404

ABSTRACT:
Disclosed is apparatus for mounting an electronic device package on a printed circuit board or the like. The apparatus includes a frame for receiving the electronic device package with the leads of the electronic device package presented for solderable connection to preformed locations on the printed circuit board. Solderable means are provided to mount the frame and the electronic device package on the printed circuit board. A clip engaging a heat sink is secured to the frame to urge the heat sink into intimate thermal contact with the electronic device package.

REFERENCES:
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patent: 4167031 (1979-09-01), Patel
patent: 4321423 (1982-03-01), Johnson
patent: 4403102 (1983-09-01), Jordan
patent: 4504886 (1985-03-01), Cygan
patent: 4539621 (1985-09-01), Currier
patent: 4546408 (1985-10-01), Rodseth
patent: 4625260 (1986-11-01), Jordan
patent: 4660123 (1987-04-01), Hermann
patent: 4716494 (1987-12-01), Bright

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