Stock material or miscellaneous articles – Composite – Of epoxy ether
Reexamination Certificate
2005-05-25
2008-10-07
Feely, Michael J (Department: 1796)
Stock material or miscellaneous articles
Composite
Of epoxy ether
C257S793000, C438S127000, C523S400000, C525S523000
Reexamination Certificate
active
07431990
ABSTRACT:
An objective of this invention is to provide an epoxy resin composition for encapsulating a semiconductor chip, which is excellent in flowability and moldability without deterioration in crack resistance during soldering and flame retardance. Specifically, this invention provides a resin composition for encapsulating a semiconductor chip comprises an epoxy resin (A) containing the specific structure; a phenolic resin (B) containing the specific structure; an inorganic filler (C); a curing accelerator (D); a silane coupling agent (E); and Compound (F) containing an aromatic ring in which at least two adjacent carbon atoms of the ring member carbon atoms are coupled to a hydroxyl group, respectively.
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Machine translation of JP 07-173255, provided by the JPO website (1995).
Machine translation of JP 2003-165896, provided by the JPO website (2003).
Machine translation of JP 2003-128759, provided by the JPO website.
International Search Report dated: Aug. 30, 2005.
Feely Michael J
Smith Gambrell & Russell
Sumitomo Bakelite Co
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