Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate
2007-01-26
2008-09-09
Le, Dung A. (Department: 2818)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Subsequent separation into plural bodies
C438S459000, C438S508000, C257S059000, C257S072000, C257SE27111, C257SE29117
Reexamination Certificate
active
07422964
ABSTRACT:
A manufacturing method of a thin film apparatus, includes: a first step for forming a separation layer on a heat resistant substrate; a second step for forming a thin film device on the separation layer; a third step for providing a surface layer on the thin film device; and a fourth step for generating a peeling phenomenon at the interface of the separation layer and the heat resistant substrate so as to peel the heat resistant substrate from a side of the thin film device.
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Le Dung A.
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Ricoh & Company, Ltd.
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