Substrate passage formation

Details Substrate passage formation Substrate passage formation

2004-04-29

2008-09-30

Norton, Nadine (Department: 1792)

Etching a substrate: processes

Forming or treating thermal ink jet article

C216S017000, C347S054000

Reexamination Certificate

active

07429335

ABSTRACT:
A method for forming an opening through a substrate includes removing a first portion of a first face of a substrate to form a first recessed surface oblique to the first face and removing a second portion of the substrate to form a passage extending through the substrate such that the passage is bordered by the first surface.

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