Wiring board manufacturing method

Details Wiring board manufacturing method Wiring board manufacturing method

2005-11-04

2008-05-27

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S832000, C029S846000

Reexamination Certificate

active

07377030

ABSTRACT:
The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.

REFERENCES:
patent: 7152314 (2006-12-01), Shuto et al.
patent: 2-65198 (1990-03-01), None
patent: 3-82193 (1991-04-01), None
patent: 7-106769 (1995-04-01), None
patent: 2001-26747 (2001-09-01), None
patent: 2002-185139 (2002-06-01), None

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