Hybrid package with non-insertable and insertable conductive...

Details Hybrid package with non-insertable and insertable conductive... Hybrid package with non-insertable and insertable conductive...

2006-03-27

2008-09-30

Tran, Long K (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S015000, C438S051000, C438S055000, C257S678000, C257S798000, C324S755090, C324S1540PB, C439S073000, C439S342000

Reexamination Certificate

active

07429497

ABSTRACT:
A hybrid electronic circuit package (102,FIG.1) includes non-insertable conductive features (110) and insertable conductive features (112) at a surface of the package. A hybrid receptacle (120), such as a socket, for example, includes non-insertable contacts (124) and insertable contacts (126), which are positioned in a complementary manner with the non-insertable and insertable features of the package. A vertical securement device (132, 134, 136) applies a vertical compressive force to the package (102) to compress the non-insertable features (110) against the non-insertable contacts (124). Further, a normal force securement device can be used to provide a sustained normal force to compress the insertable features and contacts together. In one embodiment, the non-insertable features are land grid array lands and the insertable features are low insertion force features.

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