Interconnects with improved reliability

Details Interconnects with improved reliability Interconnects with improved reliability

2005-07-07

2008-03-25

Pham, Hoai v (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S762000, C257S774000, C257SE23145

Reexamination Certificate

active

07348672

ABSTRACT:
An interconnect architecture with improved reliability. An interconnect with rounded top corners is inlaid in a dielectric layer. A filler borders the interconnect along the corners of the interconnect.

REFERENCES:
patent: 4801559 (1989-01-01), Imaoka
patent: 6107687 (2000-08-01), Fukada et al.
patent: 6208008 (2001-03-01), Arndt et al.
patent: 6368953 (2002-04-01), Petrarca et al.
patent: 6630402 (2003-10-01), Hshieh et al.
patent: 6917108 (2005-07-01), Fitzsimmons et al.
patent: 2002/0092763 (2002-07-01), Denning et al.
patent: 2003/0027092 (2003-02-01), Wolgamuth et al.
patent: 2003/0114000 (2003-06-01), Noguchi
patent: 2004/0187304 (2004-09-01), Chen et al.
patent: 2004/0214425 (2004-10-01), Lin et al.

Affiliated with

Also associated with

Rating

Interconnects with improved reliability does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interconnects with improved reliability, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interconnects with improved reliability will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3979784