Method for checking a condition of a heat treatment

Semiconductor device manufacturing: process – With measuring or testing

Reexamination Certificate

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Details

C438S010000, C438S011000, C374S161000, C374S162000

Reexamination Certificate

active

07422913

ABSTRACT:
A method for connecting terminals is provided. The method includes steps of a) providing a board having a first terminal thereon; b) performing a check of a heat treatment by using a thermal sensitive paper in order to determine a optimal condition of the heat treatment for the board; c) heating the first terminal under the optimal condition of the heat treatment; and d) connecting a second terminal to the heated first terminal.

REFERENCES:
patent: 5494179 (1996-02-01), Hori et al.
patent: 2004/0251527 (2004-12-01), Van Puymbroeck et al.

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