Memory module assembly

Details Memory module assembly Memory module assembly

2006-05-15

2008-03-25

Chérvinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S715000, C257S718000, C257S719000, C165S080300, C165S185000

Reexamination Certificate

active

07349220

ABSTRACT:
A memory module assembly includes a printed circuit board (10) having a heat-generating electronic component (50) thereon, a pair of heat-dissipating plates (20) attached on the printed circuit board, and a pair of clamps (30) clamping the heat-dissipating plates and the printed circuit board therebetween. Each heat-dissipating plate includes a pair of supporters (28) and a handle (24) rotatably engaging with the supporters. The heat-dissipating plates are installed on the opposite sides of the printed circuit board by exerting a force to the handles to make them move toward each other wherein the force overcomes the spring force of the clamps.

REFERENCES:
patent: 5109318 (1992-04-01), Funari et al.
patent: 5815371 (1998-09-01), Jeffries et al.
patent: 5966287 (1999-10-01), Lofland et al.
patent: 6119765 (2000-09-01), Lee
patent: 6233150 (2001-05-01), Lin et al.
patent: 6535387 (2003-03-01), Summers et al.
patent: 7079396 (2006-07-01), Gates et al.
patent: 7221569 (2007-05-01), Tsai
patent: 2003/0026076 (2003-02-01), Wei
patent: 2005/0276021 (2005-12-01), Gates et al.

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