Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2004-11-23
2008-09-02
Sefer, A. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S723000, C257S784000, C257SE25030, C257SE23011
Reexamination Certificate
active
07420281
ABSTRACT:
A stacked chip semiconductor device whose size is substantially reduced by high density packaging of two or more semiconductor chips. In the semiconductor device, four semiconductor chips are stacked over a printed wiring board. The bottom semiconductor chip has an interface circuit which includes a buffer and an electrostatic discharge protection circuit. All signals that these semiconductor chips receive and send are inputted or outputted through the interface circuit of the bottom semiconductor chip. Since the other semiconductor chips require no interface circuit, the semiconductor device is compact.
REFERENCES:
patent: 6141204 (2000-10-01), Schuegraf et al.
patent: 6198136 (2001-03-01), Voldman et al.
patent: 6376904 (2002-04-01), Haba et al.
patent: 6426560 (2002-07-01), Kawamura et al.
patent: 6433421 (2002-08-01), Masuda et al.
patent: 6621155 (2003-09-01), Perino et al.
patent: 6744141 (2004-06-01), Kimura
patent: 6777790 (2004-08-01), Corisis
patent: 6996692 (2006-02-01), Kouno
patent: 2001/0011766 (2001-08-01), Nishizawa et al.
patent: 2002/0140107 (2002-10-01), Kato et al.
patent: 2002/0195697 (2002-12-01), Mess et al.
patent: 2003/0199119 (2003-10-01), Lin
patent: 10-41458 (1998-02-01), None
Miles & Stockbridge P.C.
Renesas Technology Corp.
Rodela Eddie A
Sefer A.
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