Design and method for plating PCI Express (PCIE) edge connector

Details Design and method for plating PCI Express (PCIE) edge connector Design and method for plating PCI Express (PCIE) edge connector

2007-02-06

2008-03-11

Duverne, J. F. (Department: 2839)

Electrical connectors

With insulation other than conductor sheath

Plural-contact coupling part

Reexamination Certificate

active

07341490

ABSTRACT:
Embodiments of methods and apparatus for plating a PCI Express edge connector are described. In one embodiment, a printed circuit board having connectors is employed for electroplating one or more of the connectors formed thereon. The printed circuit board comprises a substrate having one or more layers, and a plurality of connectors formed on one or more of the layers, wherein at least one connector includes at least one short pin and at least one extra pin. The at least one extra pin extends beyond an outer shape of the printed circuit board after fabrication. The printed circuit board also includes connection circuitry formed on one or more of the layers, wherein the connection circuitry is configured to electrically connect the short pin with the extra pin at least during electroplating of said short pin.

REFERENCES:
patent: 6302700 (2001-10-01), Puri et al.
patent: 6319418 (2001-11-01), Verdeflor
patent: 6428360 (2002-08-01), Hassanzadeh et al.
patent: 6520805 (2003-02-01), Hassanzadeh et al.
patent: 6701400 (2004-03-01), Hayes et al.
patent: 6736660 (2004-05-01), Ku
patent: 6848927 (2005-02-01), Shirai

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