Substrates adapted for adhesive bonding

Details Substrates adapted for adhesive bonding Substrates adapted for adhesive bonding

2005-02-28

2008-03-11

Nguyen, Thinh (Department: 2861)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

Reexamination Certificate

active

07341330

ABSTRACT:
A first substrate suitable for bonding to a second substrate using an adhesive is provided. The first substrate has a plurality of etched trenches defined in a first bonding surface. The etched trenches are configured for receiving the adhesive during bonding, thereby increasing the adhesive bond strength. The first substrates are exemplified by semiconductor chips.

REFERENCES:
patent: 4994825 (1991-02-01), Saito et al.
patent: 5855713 (1999-01-01), Harvey
patent: 5896149 (1999-04-01), Kitahara et al.
patent: 6127243 (2000-10-01), Werner et al.
patent: 6288451 (2001-09-01), Tsao
patent: 6406636 (2002-06-01), Vaganov
patent: 6410859 (2002-06-01), King
patent: 6433390 (2002-08-01), Hara
patent: 7070263 (2006-07-01), Okazawa
patent: 2003/0116276 (2003-06-01), Weldon et al.
patent: 2003/0209314 (2003-11-01), Guo et al.
patent: 2004/0011761 (2004-01-01), Dewa
patent: 2004/0092804 (2004-05-01), Rayssac
patent: 2005/0029222 (2005-02-01), Chen

Affiliated with

Also associated with

Rating

Substrates adapted for adhesive bonding does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrates adapted for adhesive bonding, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrates adapted for adhesive bonding will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3967906