Method for producing a CPP thin-film magnetic head

Details Method for producing a CPP thin-film magnetic head Method for producing a CPP thin-film magnetic head

2005-05-24

2008-09-02

Kim, Paul D (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S603130, C029S603150, C029S603180, C360S122000, C360S317000, C360S319000, C451S005000, C451S041000, C216S062000, C216S065000, C216S066000

Reexamination Certificate

active

07418778

ABSTRACT:
A CPP thin-film magnetic head includes a bottom shield layer; a top shield layer, the bottom shield layer and the top shield layer being disposed at a predetermined interval; a thin-film magnetic head element between the bottom shield layer and the top shield layer; an insulating layer behind the thin-film magnetic head element in the height direction and disposed between the bottom shield layer and the top shield layer; and a metal layer in the insulating layer, the top shield layer including a first top shield sublayer on the thin-film magnetic head element; and a second top shield sublayer behind the first top shield sublayer in the height direction, the second top shield sublayer and the bottom shield layer being conductively connected through the metal layer, wherein a current flows in the direction orthogonal to a surface of a layer constituting the thin-film magnetic head element.

REFERENCES:
patent: 5907459 (1999-05-01), Shouji et al.
patent: 6387285 (2002-05-01), Sasaki
patent: 6392852 (2002-05-01), Sasaki
patent: 56-090535 (1981-07-01), None
patent: 09-326556 (1997-12-01), None
patent: 2002-74936 (2002-03-01), None
patent: 2003-059008 (2003-02-01), None
patent: 2003-152245 (2003-05-01), None
patent: 2004-031838 (2004-01-01), None
Notification of Reasons for Refusal for corresponding Japanese Patent Application Serial No. 2004-161959 dated Jun. 12, 2007.

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