Connection of leadless integrated circuit package to a circuit b

Details Connection of leadless integrated circuit package to a circuit b Connection of leadless integrated circuit package to a circuit b

1982-12-27

1985-04-23

Kucia, R. R.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

174 52FP, 174 685, 339 17CF, 361403, H05K 118

Patent

active

045133530

ABSTRACT:
A device for connecting leadless integrated circuit packages to a chip carrier housing or socket and then to a printed circuit board is taught. Briefly stated, a mask is selectively disposed on a printed circuit board. Locating ribs are correspondently disposed on a chip carrier housing so as to cooperatively engage the slots created by the absence of the mask on the printed circuit board. Additionally, barriers for separating contacts contained in the chip carrier housing are maintained at the interior and the exterior portion of the chip carrier housing walls with no material disposed therebetween thereby minimizing capacitive as well as inductive effects which may come about. Additionally, four discrete interlocking brackets are disposed on top of the chip carrier housing which allow for complete assembly of the chip carrier to the printed circuit board before mating of an integrated circuit chip with the retaining brackets then interlocked so as to relatively rigidly maintain a chip carrier in electrical contact with the contacts. The present device therefore allows for relatively fast accurate alignment of all attendant contact surfaces.

REFERENCES:
patent: 2938068 (1960-05-01), Silverschotz
patent: 3930115 (1975-12-01), Uden et al.
patent: 3982159 (1976-09-01), Dennis et al.
patent: 4303291 (1981-12-01), Dines
patent: 4359252 (1982-11-01), Olsson et al.
patent: 4410927 (1983-10-01), Butt
patent: 4417778 (1983-11-01), Halvorsen

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